TOWA Corporation (TSE:6315) is a Kyoto-based specialist in semiconductor compression molding equipment — the systems that encapsulate chips in epoxy resin after wafer processing. TOWA and Besi (Netherlands) are the two dominant global suppliers in this category, which has become strategically critical as advanced packaging (CoWoS, fan-out WLP, SiP, panel-level packaging) drives explosive demand. Operating margin ~30%, revenue approximately doubled from FY2022 to FY2025. US-JOINT consortium member. TOPIX constituent.